|
項目
Project |
量產
Mass production |
樣品
Sample |
|
|
材料
Material |
普通Tg、高Tg FR-4、無鹵素板、金屬基板、高頻板材（Rogers、Arlon、Taconic、Nelco）、聚酰亞胺（PT） Ordinary Tg, high Tg FR-4, halogen-free board, metal substrate, high-frequency board (Rogers, Arlon, Taconic, Nelco), polyimide (PT) |
||
|
表面處理
Surface treatment |
有鉛噴錫、無鉛噴錫、防氧化、化學沉鎳金、化學沉錫、化學沉銀、鍍硬金、鍍純厚金 There are lead tin spray, lead-free tin spray, anti-oxidation, electroless nickel gold, electroless tin, electroless silver, hard gold plating, pure thick gold plating |
||
|
特殊工藝板
Special craft board |
厚銅板、盲/埋孔板、特性阻抗板、高頻混壓金層板、金屬基板、樹脂塞孔板、背鉆板 Thick copper plate, blind/buried hole plate, characteristic impedance plate, high frequency mixed pressure gold layer plate, metal substrate, resin plug hole plate, back drill plate |
||
|
最高層數
Maximum number of layers |
20
|
40
|
|
|
成品板厚
Finished board thickness |
最小
The smallest |
0.5mm(20mil)
|
0.1mm(4mil)
|
|
最大
Maximum |
3.5mm(140mil)
|
605mm(260mil)
|
|
|
板厚公差 |
板厚 Board thickness ≤1.0mm(40mil):±0.1mm(4mil) 板厚 Board thickness >1.0mm(40mil):±10%
|
||
版權所有：廣德寶達精密電路有限公司 備案號： 皖ICP備13014570號-1 網站建設：中企動力 杭州